ADHESIVE BONDING METHOD - SAE MAGNETICS HK LTD

Title:

ADHESIVE BONDING METHOD

Document Type and Number:

Japanese Patent JP2010180404

Kind Code:

A

Abstract:

To provide an adhesive bonding method maintaining the optimal positions of the components to be adhered.

The adhesive bonding method includes: a step 31 of providing a first component and a second component to be adhered and an adhesive; a step 32 of placing the adhesive between the first component and the second component and bring the adhesive into contact with the first component and the second component; a step 33 of arranging at least one light concentrator; and a step 34 of arranging a light source so that at least part of rays from the light source passes through the light concentrator and the first component sequentially, irradiating the adhesive to cure the adhesive, thereby adhering the first component to the second component.

More Like This:

JPH0893172	WALL PAPER STICKING FURRING STRIP AND STICKING METHOD THEREFOR
JPH0934130	REMOVING METHOD FOR RESIST AND ADHESIVE SHEET USED THEREFOR
JP6458953	How to bond hydrogel

Inventors:

MAK WINGKEUNG
SIU TINHOI
LIU XIAOXI
GUILLEN GAMBOA
GONG DIANJUN
SI WEI

Application Number:

JP2010024540A

Publication Date:

August 19, 2010

Filing Date:

February 05, 2010

Export Citation:

Click for automatic bibliography generation Help