Title:
ADHESIVE COATING DEVICE
Document Type and Number:
Japanese Patent JP3398421
Kind Code:
B2
Abstract:
PURPOSE: To provide an adhesive coating device enabling to form data of coating position with little effort.
CONSTITUTION: In the case of applying an adhesive on a chip type electronic part, data for length 12 of the part and thickness 13 of the part are inputted in a part library 4. Hence each of data for head speed 5, selection 6 of a coating nozzle, coating quantity 7, number 8 of coating times, coating pitch 9 and a coating direction 10 is formed from information initialized as an optimized value in an internal memory of the adhesive coating device with eittle effort.
Inventors:
Hitoshi Nakahira
Seishiro Yanike
Seishiro Yanike
Application Number:
JP15826293A
Publication Date:
April 21, 2003
Filing Date:
June 29, 1993
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B05C1/16; B05C5/00; H05K3/34; (IPC1-7): B05C5/00; B05C1/16; H05K3/34
Domestic Patent References:
| JP4342144A |
Attorney, Agent or Firm:
Yoshihiro Morimoto