Title:
ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2023154283
Kind Code:
A
Abstract:
To provide an adhesive composition and an adhesive film for circuit connection which can provide a circuit connection structure that makes connection resistance between opposing electrodes less likely to increase even under high-temperature and high-humidity conditions, and a circuit connection structure and a method for manufacturing the same.SOLUTION: An adhesive film for circuit connection contains a resin component containing a thermoplastic resin, a radical-polymerizable compound and a radical polymerization initiator, and conductive particles, and contains a cyclopolymerizable monomer as the radical-polymerizable compound.SELECTED DRAWING: None
Inventors:
IWAMOTO SHINNOSUKE
KUDO SUNAO
KUDO SUNAO
Application Number:
JP2022063514A
Publication Date:
October 19, 2023
Filing Date:
April 06, 2022
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
C09J201/00; C09J4/00; C09J7/30; C09J9/02; C09J11/04; C09J11/06; C09J175/14; H01R11/01
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano