Title:
接着剤組成物及び接着フィルム
Document Type and Number:
Japanese Patent JP4235808
Kind Code:
B2
Abstract:
An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.
Inventors:
Shohei Kosakai
Nobuhiro Ichiroku
Akio Suzuki
Toshio Shiobara
Nobuhiro Ichiroku
Akio Suzuki
Toshio Shiobara
Application Number:
JP2003327487A
Publication Date:
March 11, 2009
Filing Date:
September 19, 2003
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09J179/08; C09J7/10; C09J163/00; C09J177/00; C09J183/10; H01L21/52; C08L63/00; C08L79/08
Domestic Patent References:
| JP2001329233A | ||||
| JP10245539A | ||||
| JP7268098A | ||||
| JP2002289196A | ||||
| JP2003055636A | ||||
| JP7292343A | ||||
| JP2002167367A | ||||
| JP2004327801A |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Saori Shigematsu
Katsunari Kobayashi