Title:
接着剤組成物、接着用シート、ダイシング・ダイアタッチフィルム及び半導体装置
Document Type and Number:
Japanese Patent JP4778078
Kind Code:
B2
Abstract:
The issue of this invention is to provide an adhesive agent composition that does not only have excellent adhesiveness, but also has excellent embedding performance and capable of providing high reliability for semiconductor devices while producing the semiconductor devices; and to provide an adhesive sheet using the adhesive agent composition, a die cutting-die attach film using the adhesive agent composition and having excellent feature stability and picking up stability, and a semiconductor device obtained by using the adhesive sheet or the die cutting-die attach film. The solution according to the present invention is an adhesive agent composition containing: (A) a (metha)acrylic acid resin having epoxy groups and a structural unit derived from acrylonitrile and having a weight average molecular weight of 50,000 to 1,500,000, (B) an epoxy resin having a skeleton structure of dicyclopentadiene, and (C) an aromatic polyamine having a skeleton structure of diphenylsulfone.
Inventors:
Satoshi Kouchi
Shohei Kosakai
Shohei Kosakai
Application Number:
JP2009025526A
Publication Date:
September 21, 2011
Filing Date:
February 06, 2009
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09J133/14; C09J7/00; C09J7/02; C09J11/06; C09J163/00; H01L21/301; H01L21/52
Domestic Patent References:
| JP2006176764A | ||||
| JP2010006929A |
Attorney, Agent or Firm:
Shuji Iwamiya