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Title:
ADHESIVE COMPOSITION AND BONDING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2003301156
Kind Code:
A
Abstract:

To solve such problems that a resorcinol resin-based adhesive has excellent properties, and is widely used for a laminated lumbers and the like, while involving the problems that it is unfavorable for the health of an operator because the operator sucks paraformaldehyde powder used as a curing agent for the resorcinol resin-based adhesive due to scattering in the air on operation, and also in many cases, forming a lump when blending the powder with the base resin, thus limiting further improvement of the efficiency of the bonding operation.

The conventional problems are solved by using an adhesive comprising a principal agent composed of the resorcinol-based resin and a curing agent blended with a component containing at least an oxazolidine compound, and the efficiency of the bonding operation is improved by using a method by feeding the resin and the curing agent separately, mixing them in a mixer and then applying the mixture by using a discharging type coater.


Inventors:
Harada, Mitsuyoshi
Matsui, Kiyotoshi
Kato, Yoshiaki
Application Number:
JP2002000108751
Publication Date:
October 21, 2003
Filing Date:
April 11, 2002
Export Citation:
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Assignee:
AICA KOGYO CO LTD
International Classes:
B05D7/24; C09J5/00; C09J161/12; B05D7/24; C09J5/00; C09J161/00; (IPC1-7): C09J161/12; B05D7/24; C09J5/00