Title:
ADHESIVE COMPOSITION AND CONNECTION STRUCTURE OF CIRCUIT MEMBER USING THE SAME
Document Type and Number:
Japanese Patent JP2011038075
Kind Code:
A
Abstract:
To provide an adhesive composition capable of obtaining excellent strength even when cured at a low temperature and for a short time as well as fully maintaining characteristics such as adhesive strength and connection resistance even after a reliability test (an exposure test for a long period of time under high temperature and high humidity conditions), and to provide a connection structure of a circuit member using the adhesive composition.
This adhesive composition includes a thermoplastic resin (a), a radically polymerizable compound (b), a dendritic compound (c) the branched part of which binds to a core part so as to make a dendritic branch and has a terminal part at its end, and a radical polymerization initiator (d).
Inventors:
IZAWA HIROYUKI
KATOGI SHIGEKI
KUDO KEIKO
KATOGI SHIGEKI
KUDO KEIKO
Application Number:
JP2010112509A
Publication Date:
February 24, 2011
Filing Date:
May 14, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J201/00; C09J4/00; H01L21/60
Domestic Patent References:
| JP2003277489A | 2003-10-02 | |||
| JP2005029734A | 2005-02-03 | |||
| JP2008007591A | 2008-01-17 | |||
| JPH11193318A | 1999-07-21 | |||
| JP2009074027A | 2009-04-09 | |||
| JP2011038080A | 2011-02-24 | |||
| JP2004514016A | 2004-05-13 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu
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