Title:
ADHESIVE COMPOSITION CONTAINING DIMER DIOL-COPOLYMERIZED POLYIMIDE URETHANE RESIN AND MALEIMIDE
Document Type and Number:
Japanese Patent JP2021161129
Kind Code:
A
Abstract:
To provide an adhesive composition that excels in adhesiveness, dry solder heat resistance and low dielectric properties.SOLUTION: An adhesive composition contains a polyimide urethane resin (A) containing, as copolymerization components, a polycarboxylic acid derivative component having an acid anhydride group (a1), a dimer diol component (a2), and an isocyanate component (a3), and a maleimide (B). The copolymerization components of the polyimide urethane resin (A) may further include an unsaturated bond component (a4). The unsaturated bond component (a4) may be a hydroxy group-terminated polybutadiene.SELECTED DRAWING: None
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Inventors:
IRISAWA HAYATO
KAWAKUSU TETSUO
KAWAKUSU TETSUO
Application Number:
JP2020060682A
Publication Date:
October 11, 2021
Filing Date:
March 30, 2020
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
C09J175/04; B32B27/34; B32B27/40; C08G18/34; C08G18/67; C09J175/14; C09J179/08; H05K1/03