Title:
ポリファルネセンを含む接着剤組成物
Document Type and Number:
Japanese Patent JP5624986
Kind Code:
B2
Abstract:
Adhesive composition comprises a polyfarnesene and a tackifier. The polyfarnesene can be a farnesene homopolymer derived from a farnesene (e.g., a-farnesene or ß-farnesene) or a farnesene interpolymer derived from a farnesene and at least a vinyl monomer. In some embodiments, the at least one vinyl monomer is ethylene, an a-olef?n such as styrene, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof. The composition disclosed herein can be used as a hot melt adhesive, a pressure sensitive adhesive or the like.
Inventors:
デレク ジャメス ムクプヘエ
マトトヘウ ジェイ．グラハム
マトトヘウ ジェイ．グラハム
Application Number:
JP2011526039A
Publication Date:
November 12, 2014
Filing Date:
September 03, 2009
Export Citation:
Assignee:
アムイリス，インコーポレイテッド
International Classes:
C08L47/00; C08F36/22; C08F297/00; C08L101/00; C09J11/06; C09J153/00; C09J201/00
Attorney, Agent or Firm:
Ishikawa 徹