Title:
ADHESIVE COMPOSITION, COPPER-CLAD LAMINATE PLATE USING THE SAME, COVER-LAY FILM AND ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2009167396
Kind Code:
A
Abstract:
To provide an adhesive composition excellent in adhesiveness and insulation reliability, and to provide a copper-clad laminate plate, a cover-lay film and an adhesive sheet comprising the adhesive composition.
The adhesive composition comprises: a phenoxy resin; a carboxy group-containing acrylonitrile butadiene rubber; a carboxy group-containing acrylonitrile butadiene-modified epoxy resin; and a hardener.
Inventors:
NISHIOKA DAIKICHI
SAWAMURA TAIJI
SAWAMURA TAIJI
Application Number:
JP2008320656A
Publication Date:
July 30, 2009
Filing Date:
December 17, 2008
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C09J109/02; C09J7/00; C09J11/06; C09J163/00; C09J171/10; H05K1/03; H05K3/28