Title:
ADHESIVE COMPOSITION AND COPPER-CLAD LAMINATE
Document Type and Number:
Japanese Patent JPH11343476
Kind Code:
A
Abstract:
To provide an adhesive composition excellent in moisture proof and to provide a copper-clad laminate using the same.
When an adhesive composition contains (1) an epoxy resin, (2) an elastomer having carboxyl, (3) a curing agent and (4) a hardening accelerator, the accelerator of this invention consists of (A) an imidazole derivative and (B) at least one of an aromatic carboxylic acid and its anhydride.
Inventors:
HATTORI SHIGEMITSU
SHIMIZU TAKAYUKI
SHIMIZU TAKAYUKI
Application Number:
JP15338898A
Publication Date:
December 14, 1999
Filing Date:
June 02, 1998
Export Citation:
Assignee:
TOKAI RUBBER IND LTD
International Classes:
C08L13/00; C08G59/68; C09J113/00; C09J163/00; H05K1/03; (IPC1-7): C09J163/00; C08G59/68; C08L13/00; C09J113/00; H05K1/03
Attorney, Agent or Firm:
Nishihiko Yasuhiko