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Patent Searching and Data


Title:
ADHESIVE COMPOSITION AND COVERLAY FILM AND ADHESIVE SHEET USING THE SAME
Document Type and Number:
Japanese Patent JP2007051212
Kind Code:
A
Abstract:

To provide a coverlay film and an adhesive sheet which are halogen free and have excellent frame retardancy, migration and adhesion properties and an adhesive agent composition used for the same.

The adhesive agent composition comprises (A) a urethane-modified carboxyl group-containing polyester resin, (B) a non-halogen epoxy resin, (C) a curing agent, (D) a phosphorus-based flame retardant and (E) an inorganic filler. The rate of each component is 100 pts.mass component (A), 5-100 pts.mass component (B), 0.1-30 pts.mass component (C), 10-60 mass% of the component (E) based on the sum total of the components (A) to (C) and the rate of phosphorus element in the whole organic solid components is ≥2.5 mass%. The coverlay film comprises an electric insulation film layer and a layer comprising the composition and laid on the film layer. The adhesive sheet have the layer comprising the composition and a releasing material layer covering the layer comprising the composition.


Inventors:
ARAI HITOSHI
NAKANISHI NOBORU
HOSHIDA SHIGEHIRO
AMANO TADASHI
Application Number:
JP2005237008A
Publication Date:
March 01, 2007
Filing Date:
August 17, 2005
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C09J167/00; B32B7/02; B32B7/04; B32B27/18; B32B27/36; B32B27/38; C09J5/00; C09J7/02; C09J11/00; C09J163/00; C09J175/06; H05K1/03; H05K3/28
Domestic Patent References:
JP2005125724A2005-05-19
JPH11116930A1999-04-27
JP2000345005A2000-12-12
JP2005015595A2005-01-20
Attorney, Agent or Firm:
Shuji Iwamiya