Title:
ダイシングテープ用粘着組成物およびこれを含むダイシングテープ
Document Type and Number:
Japanese Patent JP7233800
Kind Code:
B2
Abstract:
The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
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Inventors:
Da e Kim
Dj Hmd
Kwan Ju Yi
Eun Young Kim
Mi Jang
Dj Hmd
Kwan Ju Yi
Eun Young Kim
Mi Jang
Application Number:
JP2021545907A
Publication Date:
March 07, 2023
Filing Date:
August 13, 2020
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H01L21/301; C09J7/38; C09J11/06; C09J133/04
Domestic Patent References:
| JP2007238802A | ||||
| JP2016196614A | ||||
| JP2017508304A |
Foreign References:
| WO2019084397A1 |
Attorney, Agent or Firm:
Shinya Mihiro
Takashi Watanabe
Takashi Watanabe