ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENT AND ADHESIVE SHEET FOR ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT USING THE SAME

Title:

ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENT AND ADHESIVE SHEET FOR ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT USING THE SAME

Document Type and Number:

Japanese Patent JP2015034249

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide an adhesive composition for an electronic component forming an adhesive layer excellent in adhesive durability at high temperature and insulation durability at high temperature under high moisture and having reduced warpage.SOLUTION: Provided is an adhesive composition for an electronic component comprising: (A) a polyamide resin including a dimer acid residue; (B) a heat crossing agent; and (C) an organic compound having a tetrathiafulvalene skeleton.

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Inventors:

MUROI TAKAYUKI
SHIMIZU HIROO
MAEDA AKIHIRO

Application Number:

JP2013166331A

Publication Date:

February 19, 2015

Filing Date:

August 09, 2013

Export Citation:

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Assignee:

TORAY INDUSTRIES

International Classes:

C09J177/06; B32B27/00; B32B27/26; B32B27/34; C09J7/02; C09J11/06; C09J163/00

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