Title:
ADHESIVE COMPOSITION, ELECTRONIC MEMBER USING THE ADHESIVE COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015140408
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive having transparency after curing, capable of being cured at low temperature (for example at 100°C or less), preventing warping even when a thin adherend (for example thin wafer) is applied, having excellent adhesiveness to a substrate and excellent in reflow detachment resistance at 260°C.SOLUTION: There is provided an adhesive composition containing (a) an acrylic polymer having a weight average molecular weight of 100,000 or more, (b) a compound having at least two (meth)acryloyl group and (c) an organic peroxide having 1 hour half-life temperature of 70 to 115°C.
Inventors:
IKEDA AYA
KATO SADAAKI
FUJII SHINJIRO
KATO SADAAKI
FUJII SHINJIRO
Application Number:
JP2014014860A
Publication Date:
August 03, 2015
Filing Date:
January 29, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J4/06; C09J11/06; C09J133/00; H01L21/52
Domestic Patent References:
| JP2009057550A | 2009-03-19 | |||
| JP2003129006A | 2003-05-08 | |||
| JP2012167174A | 2012-09-06 | |||
| JP2016169194A | 2016-09-23 | |||
| JP2011204898A | 2011-10-13 | |||
| JP2013040326A | 2013-02-28 | |||
| JP2013124289A | 2013-06-24 | |||
| JP2013001847A | 2013-01-07 | |||
| JP2010001449A | 2010-01-07 |
Foreign References:
| WO2012077806A1 | 2012-06-14 | |||
| WO2013061923A1 | 2013-05-02 | |||
| WO2014046182A1 | 2014-03-27 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Junichiro Sakamaki
Yoshinori Shimizu
Tomoya Furoshita
Junichiro Sakamaki