電子部品用接着剤組成物およびそれを用いた電子部品用接着シート

Title:

電子部品用接着剤組成物およびそれを用いた電子部品用接着シート

Document Type and Number:

Japanese Patent JP5286679

Kind Code:

B2

Abstract:

To provide an adhesive composition for electronic parts capable of forming an adhesive layer excellent in adhesive durability under an elevated temperature and in insulation durability under an elevated temperature and an elevated humidity, as well as with less warpage.

This adhesive composition for the electronic parts comprises a polyamide resin and a thermosetting resin, in which the polyamide resin has a structural unit composed of a dimer acid and an amine containing at least one atom selected from among phosphorus, sulfur and oxygen, and ≥2 amino groups.

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Inventors:

Yukitsuna Konishi
Akihiro Maeda
Yasushi Sawamura

Application Number:

JP2007066241A

Publication Date:

September 11, 2013

Filing Date:

March 15, 2007

Export Citation:

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Assignee:

TORAY INDUSTRIES,INC.

International Classes:

C09J177/06; B32B15/088; B32B27/34; C09J7/02; C09J161/06; C09J201/00; H01L21/52

Domestic Patent References:

JP10178055A
JP5078641A

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