Title:
ADHESIVE COMPOSITION, FILMY ADHESIVE AND METHOD FOR PEELING ADHEREND
Document Type and Number:
Japanese Patent JP2013209484
Kind Code:
A
Abstract:
To provide an adhesive composition which lowers adhesive force by heating, electromagnetic wave irradiation, or the like, to provide a filmy adhesive using the same, and to provide a method for peeling an adherend therewith.
There are provided an adhesive composition comprising an adhesive, and low melting point glass dispersed in the adhesive; and a filmy adhesive containing the adhesive composition.
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Inventors:
MASUDA KATSUYUKI
EJIRI TAKAKO
SHINADA EIITSU
YAMAGUCHI MASATOSHI
KOIBUCHI SHIGERU
YAMAMOTO KAZUNORI
NAITO TAKASHI
EJIRI TAKAKO
SHINADA EIITSU
YAMAGUCHI MASATOSHI
KOIBUCHI SHIGERU
YAMAMOTO KAZUNORI
NAITO TAKASHI
Application Number:
JP2012079809A
Publication Date:
October 10, 2013
Filing Date:
March 30, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J201/00; C08G69/40; C09J5/06; C09J7/00; C09J11/04; C09J177/06; C09J179/08
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Junichiro Sakamaki
Yoshinori Shimizu
Junichiro Sakamaki