Title:
ADHESIVE COMPOSITION FOR FLEXIBLE PANEL
Document Type and Number:
Japanese Patent JP2010065096
Kind Code:
A
Abstract:
To provide an adhesive composition for a flexible panel which imparts tackiness to an adhesive, achieves good temporal fixation of flexible substrates in a sticking step, can maintain adhesion of the substrates also after curing, and achieves adequate conduction because it holds conducting particles as an ACS (Anisotropic Conductive Seal).
The adhesive composition includes a thermosetting epoxy resin and an elastomer having rubber properties and is used as a sealing agent to seal a void due to a gap between two flexible substrates in a flexible panel of a structure formed by sticking two flexible substrates at least one of which is provided with a member for ensuring the gap between substrates, through the gap between substrates.
Inventors:
NISHII MASAYUKI
SAKURAI MAKOTO
SAKURAI MAKOTO
Application Number:
JP2008230992A
Publication Date:
March 25, 2010
Filing Date:
September 09, 2008
Export Citation:
Assignee:
BRIDGESTONE CORP
International Classes:
C09J163/00; C09J9/02; C09J121/00; C09K3/10
Attorney, Agent or Firm:
Kenji Sugimura
Kiyoshi Kuruma
Tatsuya Sawada
Kazuyuki Tomita
Kiyoshi Kuruma
Tatsuya Sawada
Kazuyuki Tomita