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Title:
ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS61254680
Kind Code:
A
Abstract:

PURPOSE: To provide the titled composition for bonding between plastic film and metallic foil, of high performance in heat and chemical resistance, electrical insulation, flexibility, dimensional stability and curability, comprising acryl- adduct epoxy resin and curing agent.

CONSTITUTION: The objective composition comprising (A) an acryl-adduct epoxy resin prepared by reaction between (i) an epoxy resin having at least two epoxy groups (e.g., bisphenol A type epoxy resin) and (ii) an acrylic polymer having reactive functional group (pref. COOH, amide group, methylol group) (pref. an acrylic polymer containing 0.5W10wt% and 2W40wt% of reactive functional group-contg. monomer and acrylonitrile respectively) and (B) a curing agent (e.g., dicyandiamide).


Inventors:
TOMONAGA KAZUYUKI
YAYOSHI MASAKAZU
Application Number:
JP9559685A
Publication Date:
November 12, 1986
Filing Date:
May 07, 1985
Export Citation:
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Assignee:
TOSHIBA CHEM CORP
International Classes:
H05K3/38; C08G59/00; C08G59/16; C08L63/00; C08L77/00; (IPC1-7): C08L63/00; C09J3/16; H05K3/38
Domestic Patent References:
JPS5584379A1980-06-25
JPS608314A1985-01-17
Attorney, Agent or Firm:
Eiji Morota