PURPOSE: To provide the titled composition for bonding between plastic film and metallic foil, of high performance in heat and chemical resistance, electrical insulation, flexibility, dimensional stability and curability, comprising acryl- adduct epoxy resin and curing agent.
CONSTITUTION: The objective composition comprising (A) an acryl-adduct epoxy resin prepared by reaction between (i) an epoxy resin having at least two epoxy groups (e.g., bisphenol A type epoxy resin) and (ii) an acrylic polymer having reactive functional group (pref. COOH, amide group, methylol group) (pref. an acrylic polymer containing 0.5W10wt% and 2W40wt% of reactive functional group-contg. monomer and acrylonitrile respectively) and (B) a curing agent (e.g., dicyandiamide).
JPH06326431 | CIRCUIT BOARD |
JP2019026879 | PRODUCTION METHOD OF ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT |
YAYOSHI MASAKAZU
JPS5584379A | 1980-06-25 | |||
JPS608314A | 1985-01-17 |
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