Title:
ADHESIVE COMPOSITION FOR FOIL STAMPING
Document Type and Number:
Japanese Patent JPS6356581
Kind Code:
A
Abstract:
PURPOSE: To obtain the titled composition having excellent fluidity, adhesivity and resistance to soldering temperature, etc., by adding a specific amount of a carboxyl-containing acrylonitrile-butadiene copolymer to an epoxy resin containing tetraglycidyl ether.
CONSTITUTION: The objective composition causing little flow in bonding, having excellent bonding power between hot substrate and a metal foil and bondable by wire-bonding, by compounding (A) 100pts.wt. of an epoxy resin containing ≥18wt% tetraglycidyl ether expressed by the formula with (B) 20W70pts.wt. of an acrylonitrile-butadiene copolymer containing carboxyl group and solid at normal temperature and (C) an epoxy resin hardener.
Inventors:
NEMOTO YOUSUI
ITOU AKIYOSHI
BAN HISAYOSHI
NAKANISHI TOMOAKI
SATAKE HIROAKI
ITOU AKIYOSHI
BAN HISAYOSHI
NAKANISHI TOMOAKI
SATAKE HIROAKI
Application Number:
JP19889686A
Publication Date:
March 11, 1988
Filing Date:
August 27, 1986
Export Citation:
Assignee:
MITSUBISHI PETROCHEMICAL CO
IBIDEN CO LTD
IBIDEN CO LTD
International Classes:
C09J109/02; C09J121/00; C09J163/00; H05K3/38; (IPC1-7): C09J3/14; C09J3/16
Domestic Patent References:
| JPS61162573A | 1986-07-23 | |||
| JPS57187325A | 1982-11-18 | |||
| JPS5014736A | 1975-02-17 | |||
| JPS5020998A | 1975-03-05 | |||
| JPS58202583A | 1983-11-25 | |||
| JPS5989380A | 1984-05-23 | |||
| JPS6079079A | 1985-05-04 | |||
| JPS60186579A | 1985-09-24 | |||
| JPS6176579A | 1986-04-19 |
Attorney, Agent or Firm:
Nakaya Moriya