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Title:
ADHESIVE COMPOSITION FOR THE LAMINATION OF SEMICONDUCTORS
Document Type and Number:
Japanese Patent JP2017088732
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition for the lamination of semiconductors that quickly solidifies by heating and drying, has no adhesiveness in a distribution process, and quickly cures at such a temperature that reduces damage to semiconductor chips.SOLUTION: An adhesive composition for the lamination of semiconductors has a specific compound (A) having 1-4 benzoxazine group in a molecule and a solvent (B).SELECTED DRAWING: None

Inventors:
TANAKA HIROMI
Application Number:
JP2015220348A
Publication Date:
May 25, 2017
Filing Date:
November 10, 2015
Export Citation:
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Assignee:
DAICEL CORP
International Classes:
C09J179/00; C09J7/00; C09J11/06; C09J161/10; C09J163/00; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
JP2012057039A2012-03-22
JP2013008800A2013-01-10
JP2012057133A2012-03-22
JP2014231536A2014-12-11
JP2016124980A2016-07-11
JP2011213994A2011-10-27
Foreign References:
US20040068084A12004-04-08
Attorney, Agent or Firm:
Goto Patent Office



 
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