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Title:
ADHESIVE COMPOSITION, METHOD OF BONDING WITH THE SAME, AND PRODUCTION OF COVERING MATERIAL FOR DECORATIVE SHEET
Document Type and Number:
Japanese Patent JPH10140126
Kind Code:
A
Abstract:

To obtain a water-base adhesive compsn. which has an initial adhesiveness capable of withstanding the use in a dry adhesion method and has excellent normal-state adhesive power and heat resistance similar to those obtainable by a wet adhesion method by selecting a two-component adhesive compsn. comprising a specific main component and a curative.

This adhesive compsn. is prepd. by compounding 100 pts.wt. main component comprising an emulsion of a urethane resin having polyester backbones and polyether backbones and having acid groups and an emulsion of an ethylene-vinyl acetate copolymer having an ethylene content of 5-40wt.% and a toluene insolubles content (as a dried film) of 70wt.% or higher with 2-20 pts.wt. compd. having at least two acid-reactive groups as the curative. The urethane resin is pref. The one obtd. by reacting a compd. having a polyester backbone with a compd. having a polyether backbone in a wt. ratio of (20:80)-(60:40).


Inventors:
OGUCHI YOSHIYUKI
Application Number:
JP30283696A
Publication Date:
May 26, 1998
Filing Date:
November 14, 1996
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B32B27/00; C08G18/00; C09J5/00; C09J131/04; C09J175/04; (IPC1-7): C09J175/04; B32B27/00; C09J5/00; C09J131/04