Title:
ADHESIVE COMPOSITION FOR POLYIMIDE FILM
Document Type and Number:
Japanese Patent JP2010260931
Kind Code:
A
Abstract:
To provide a silicone adhesive composition for a polyimide film having both heat resistance and adhesiveness.
The composition includes (A) an organopolysiloxane having a molecular weight of ≥1,500, and (B) an epoxy-based silane coupling agent. The viscosity of the composition is 1-50,000 mPa s at 23°C. The storage elastic modulus of the cured article is 0.01-100,000 MPa at 23°C. The adhesive composition for a polyimide film includes the composition. The structure includes the composition formed on the polyimide film having a thickness of 0.1-400 μm.
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
HISHA YUKI
WATANABE ATSUSHI
WATANABE ATSUSHI
Application Number:
JP2009111632A
Publication Date:
November 18, 2010
Filing Date:
April 30, 2009
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08L83/04; B32B27/34; C08J7/04; C08K5/5415; C09J7/02; C09J183/04
Domestic Patent References:
| JPH08183934A | 1996-07-16 | |||
| JPH01174563A | 1989-07-11 | |||
| JPS61157569A | 1986-07-17 | |||
| JPS62135561A | 1987-06-18 | |||
| JP2009242628A | 2009-10-22 |