Title:
ADHESIVE COMPOSITION AND PRODUCT USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2014196390
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide, by targeting an adhesive composition unaccompanied by blistering, cracking, etc. at the time of a drying treatment during the production thereof and exhibiting an excellent viscosity stability, a processed product and/or coated product excellent in terms of adhesive strength, water resistance, etc. without entailing the proliferation of production processes.SOLUTION: An adhesive composition including a synthetic emulsion where the sum of the respective contents of sodium and potassium with respect to 100 parts.wt. of the synthetic emulsion (solid content) is 5000 ppm or below is used.
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Inventors:
MORI BUNZO
TERANISHI TAKAO
TERANISHI TAKAO
Application Number:
JP2013072232A
Publication Date:
October 16, 2014
Filing Date:
March 29, 2013
Export Citation:
Assignee:
NIPPON A & L INC
International Classes:
C09J201/00; C09J11/06; C09J11/08
Domestic Patent References:
| JP2010100749A | 2010-05-06 | |||
| JP2011117112A | 2011-06-16 |
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