To provide an adhesive composition for semiconductor devices which has a low moisture absorbency, excels in resistance to cracking during reflow after moisture absorption, and particularly excels in crack resistance.
The adhesive composition for semiconductor devices has (A) an epoxy compound or an epoxy resin which has two or more functionalities, (B) an ester group-containing compound or an ester group-containing resin which has two or more functionalities in which 10 mol% to 100 mol% hydroxy groups have been esterified with a carboxylic acid as the curing agent, and (C) a curing accelerator composed of a compound having a specific structure as the essential components. It is preferred that the adhesive composition further comprises another thermoplastic resin such as (F) an ethylene-acrylic elastomer, (G) an epoxy group-containing acrylic copolymer containing 2-6 wt.% glycidyl (meth)acrylate which has a Tg (glass transition temperature) of ≥-50°C and a weight average molecular weight of ≥100,000, and (H) a silicone-modified polyimide.
MAEDA SUNAO
MORITA MORIJI
NISHIHARA KUNIO
