Title:
接着剤組成物、接着層付き支持体、接着フィルム、積層体及びその製造方法、並びに電子部品の製造方法
Document Type and Number:
Japanese Patent JP6971139
Kind Code:
B2
Abstract:
An object of the present invention is to provide an adhesive composition, a supporting body having an adhering layer using the same, an adhering film, a laminate, a method for manufacturing the same, and a method for manufacturing electronic components, wherein the adhesive composition is an adhesive composition used for laminating a supporting body and a substrate, and capable of forming an adhesion layer having a higher heat resistance. The solution of the present invention is to use an adhesive composition which is an adhesive composition for laminating a supporting body (12) and the substrate (4), and contains a hydrocarbon resin (P1) and a resin (P2) having a glass transition temperature of 180 DEG C or higher. (however, the aforementioned hydrocarbon resin (P1) is not included) as the resin component (P).
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Inventors:
Takahiro Yoshioka
Hiroshi Imai
Hiroshi Imai
Application Number:
JP2017239885A
Publication Date:
November 24, 2021
Filing Date:
December 14, 2017
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C09J125/02; B32B27/00; B32B27/32; C09J4/02; C09J7/20; C09J11/06; C09J179/04
Domestic Patent References:
JP2011026548A | ||||
JP2010024435A | ||||
JP4063810A | ||||
JP2013049739A |
Attorney, Agent or Firm:
Sumio Tanai
Matsumoto
Ryu Miyamoto
Masato Iida
Matsumoto
Ryu Miyamoto
Masato Iida
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