ADHESIVE COMPOSITION - KANEGAFUCHI CHEMICAL IND

Title:

ADHESIVE COMPOSITION

Document Type and Number:

Japanese Patent JP2001311054

Kind Code:

A

Abstract:

To provide an adhesive composition excellent in soldering heat resistance, heat resistance and adhesion, in particular capable of bonding at low temperatures of ≤250°C.

This adhesive composition essentially comprises (A) 100 pts.wt. of a soluble polyimide, (B) 1-100 pts.wt. of an epoxy compound having at least one epoxy ring in the molecule, and (C) 1-150 pts.wt. of a compound having at least two unsaturated double bonds.

More Like This:

JP2676540	INDUSTRIAL APPLICABILITY [Title of Invention] Two-component non-mixed acrylic adhesive composition
WO/2022/068871	BIFUNCTIONAL COUMARIN OXIME ESTER COMPOUND AND PREPARATION AND APPLICATION THEREOF
WO/2006/129678	ENERGY RAY-CURABLE RESIN COMPOSITION AND ADHESIVE USING SAME

Inventors:

OKADA YOSHIFUMI
HARA MASAYUKI
NOJIRI HITOSHI

Application Number:

JP2000130551A

Publication Date:

November 09, 2001

Filing Date:

April 28, 2000

Export Citation:

Click for automatic bibliography generation Help

Assignee:

KANEGAFUCHI CHEMICAL IND

International Classes:

C09J4/06; (IPC1-7): C09J4/06

Previous Patent: FILMY BONDING MEMBER

Next Patent: DOUBLE-SIDED ADHESIVE TAPE