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Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2009185138
Kind Code:
A
Abstract:

To provide an adhesive composition which has high bonding strength and ensures excellent transparency of a bonded place, in adhesion of a polyolefin resin molded body or in adhesion of a norbornene resin molded body.

The adhesive composition comprises a thermoplastic flexible acrylic resin (A) having Shore A hardness of 90 and an aromatic tackifier (B), wherein the thermoplastic flexible acrylic resin (A) is preferably a block copolymer consisting of monomers including methyl methacrylate and butyl acrylate, and the aromatic tackifier (B) is preferably a resin obtained by copolymerizing styrene, substituted styrene and/or phenol.


Inventors:
IMAHORI MAKOTO
Application Number:
JP2008024813A
Publication Date:
August 20, 2009
Filing Date:
February 05, 2008
Export Citation:
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Assignee:
TOAGOSEI CO LTD
International Classes:
C09J133/06; B32B27/00; B32B27/30; C09J7/02; C09J11/08; C09J133/12; C09J153/00; C09J125/08; C09J161/04
Domestic Patent References:
JP2006206624A2006-08-10
JP2006232926A2006-09-07
JPH09324165A1997-12-16
JP2006201337A2006-08-03
JP2005053976A2005-03-03
JP2006119353A2006-05-11
JP2006206657A2006-08-10
JP2007119758A2007-05-17
JP2007084762A2007-04-05
JPH08199141A1996-08-06
JP2008106176A2008-05-08
JP2006206624A2006-08-10
JP2006232926A2006-09-07
JPH09324165A1997-12-16
JP2006201337A2006-08-03
JP2005053976A2005-03-03
JP2006119353A2006-05-11
JP2006206657A2006-08-10
Foreign References:
WO2008001856A12008-01-03
WO2008001856A12008-01-03