Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2020111755
Kind Code:
A
Abstract:
To provide an adhesive composition which may form a structure effectively blocking moisture or oxygen flowing into an organic electronic device from the outside, thereby ensuring the lifespan of the organic electronic device, realize a top-emission organic electronic device, and exhibit excellent adhesive durability and reliability, and an organic electronic device including the same.SOLUTION: An adhesive composition for encapsulating an organic electronic element, comprising an olefin-based resin, a heat-curable resin, and a photocurable compound.SELECTED DRAWING: Figure 1
Inventors:
SHIM JUNG SUP
LEE SEUNG MIN
KIM SO-YON
YANG SE WOO
LEE SEUNG MIN
KIM SO-YON
YANG SE WOO
Application Number:
JP2020048045A
Publication Date:
July 27, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
LG CHEMICAL LTD
International Classes:
C09K3/10; C09J123/00; C09J201/00
Domestic Patent References:
| JP2014026853A | 2014-02-06 | |||
| JPH09148592A | 1997-06-06 |
Foreign References:
| WO2014204223A1 | 2014-12-24 |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe