Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2022047711
Kind Code:
A
Abstract:
To provide an adhesive composition from which a cured product having good curability of an adhesion end and an adhesive layer and excellent mechanical physical properties can be formed, when the adhesive layer is thick.SOLUTION: An adhesive composition contains 3-23 pts.mass of a resin (A) having a structure represented by formula (1) and a nitrile group, 50-92 pts.mass of a compound (B) having a polymerizable unsaturated group, 5-27 pts.mass of a powdery resin (C), and 0.5-15 pts.mass of a radical curing catalyst (D), in which the total of the resin (A), the compound (B) and the powdery resin (C) is 100 pts.mass. In the formula (1), X1 to X3 are each independently hydrogen or halogen, at least two X1 to X3 are halogen, and * represents a bond to other atom.SELECTED DRAWING: None
Inventors:
KOYAMA YUJI
Application Number:
JP2020153635A
Publication Date:
March 25, 2022
Filing Date:
September 14, 2020
Export Citation:
Assignee:
SOKEN KAGAKU KK
International Classes:
C09J127/24; C09J4/00; C09J7/30; C09J11/06; C09J11/08
Attorney, Agent or Firm:
Patent corporation ssinpat
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