Title:
ADHESIVE COMPOSITION AND ADHESIVE
Document Type and Number:
Japanese Patent JP2023176914
Kind Code:
A
Abstract:
To provide an adhesive composition having a low dielectric constant and a low dielectric loss tangent, and excellent in adhesiveness, and to provide an adhesive obtained by curing the adhesive composition.SOLUTION: An adhesive composition contains a polyester resin (A) having a structural site derived from polyvalent carboxylic acids (a1), and a structural site derived from polyhydric alcohols (a2). The adhesive composition is such that: a content of a structural site derived from aromatic polyvalent carboxylic acids (a1-1) is 20 mol% or more of the entire structural site derived from the polyvalent carboxylic acids (a1); and a content of a structural site derived from polydiene diols and/or hydrogenated polydiene diols (a2-1) is 50 wt.% or more of the entire polyester resin (A).SELECTED DRAWING: None
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Inventors:
NAKANE TAKAYUKI
SUZUKI HIDEAKI
SUZUKI HIDEAKI
Application Number:
JP2022089494A
Publication Date:
December 13, 2023
Filing Date:
June 01, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C09J167/00; C09J167/02; C09J167/06