Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2596876
Kind Code:
B2
Abstract:
PURPOSE: To provide an adhesive compsn. excellent in heat resistance and adhesion strength for the field of structural adhesives where a rubber is bonded to a metal through vulcanization thereof.
CONSTITUTION: Ultrahigh-mol.-wt. polyethylene or high-mol.-wt. polyethylene copolymerized with an α-olefin which has a specific surface area of 300 to 20,000cm2/g, a viscosity-average mol. wt. of 100,000 to 3,000,000 (ASTM D 2857), an m.p. of 90 to 140°C (ASTM D 2117), and a thermal deformation temp. of 60 to 140°C (ASTM D 648) is suspended in water or hydrochloric acid and then chlorinated to obtain a chlorinated polyethylene having a chlorine content of 60 to 75wt.% and a viscosity of 80 to 1,000cP as measured in the form of a 20wt.% soln. thereof in toluene at 25°C. This adhesive compsn. comprises the chlorinated polyethylene.
Inventors:
Kentaro Noboru
Kimura Tadao
Toshihide Takahashi
Kimura Tadao
Toshihide Takahashi
Application Number:
JP16847792A
Publication Date:
April 02, 1997
Filing Date:
June 03, 1992
Export Citation:
Assignee:
NIPPON PAPER INDUSTRIES CO.,LTD.
International Classes:
C08F8/20; C09J123/28; (IPC1-7): C09J123/28; C08F8/20
Domestic Patent References:
| JP3199207A |
Attorney, Agent or Firm:
Kiyoshi Minoura