Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH0570757
Kind Code:
A
Abstract:
PURPOSE: To provide an adhesive composition having good electrical insulating properties, heat resistance and processability and excellent storage stability.
CONSTITUTION: The title composition is produced by mixing 100 pts. wt. epoxy resin with 1-50 pts.wt. epoxy-containing acrylonitrile/butadiene copolymer or epoxy-containing methacrylonitrile/butadiene copolymer (0.05-0.3 epoxy group is contained per 100g of the copolymer).
Inventors:
WAKAMATSU HIROYUKI
YAMAZAKI HAJIME
YAMAZAKI HAJIME
Application Number:
JP26073291A
Publication Date:
March 23, 1993
Filing Date:
October 08, 1991
Export Citation:
Assignee:
YOKOHAMA RUBBER CO LTD
International Classes:
C09J163/00; (IPC1-7): C09J163/00
Attorney, Agent or Firm:
Shinichi Ogawa (2 outside)
Next Patent: POLYESTER-BASED ADHESIVE COMPOSITION