To obtain a one-pack adhesive composition free from organic solvent odor, having high storage stability, exhibiting excellent adhesive strength and water resistance, etc., and useful for adhesion of woods, paper materials, etc., by incorporating a specific resin-based emulsion composition with a specific curing agent.

This adhesive composition is obtained by incorporating (A) 100 pts.wt., on a resin basis, of a vinyl acetate resin-based emulsion prepared by emulsion polymerization between 100 pts.wt. of vinyl acetate and 0.1-5 pts.wt. of a carboxyl-contg. monomer using polyvinyl alcohol as protective colloid with (B) 5-100 pts.wt., on a resin basis, of an ethylene-vinyl acetate copolymer resin-based emulsion containing ≥25 wt.% of ethylene, (C) 1-20 pts.wt., on a resin basis, of an urethane resin-based emulsion, and (D) 0.5-10 pts.wt. of an aminoethylated vinyl interpolymer of the formula (R1 is H or methyl; R2 is a hydrocarbon group) or a polyamide-epichlorohydrin-based resin.