Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH1081865
Kind Code:
A
Abstract:
To provide an adhesive compsn. having an excellent adhesion to an adherend and also thermal and water resistances.
This compsn. comprises (A) an emulsion comprising an ethylene/ vinyl acetate copolymer having an ethylene content of 5 to 40wt.% and a toluene-insolubles content of at least 70wt.% or (B) an emulsion comprising a (meth)acrylic acid/ethylene/vinyl acetate copolymer having a (meth)acrylic acid content of 0.3 to 5wt.%, an ethylene content of 5 to 40wt.% and a toluene- insolubles content of at least 70wt.%, and (C) an emulsion comprising a urethane resin.
Inventors:
OGUCHI YOSHIYUKI
Application Number:
JP10752097A
Publication Date:
March 31, 1998
Filing Date:
April 24, 1997
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09J123/08; C09J131/04; C09J175/04; (IPC1-7): C09J131/04; C09J123/08; C09J175/04