Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPS6079079
Kind Code:
A
Abstract:
PURPOSE: To provide an adhesive compsn. consisting of a bisphenol epoxy resin, an N-glycidyl epoxy resin, a carboxyl group-contg. nitrile rubber and an aromatic polyamine-based hardener, having excellent adhesiveness and resistance to heat and chemicals and useful for fabrication of flexible printed circuit board.
CONSTITUTION: The adhesive compsn. is prepd. by blending (a) bisphenol epoxy resin, (b) N-glycidyl epoxy resin, (c) carboxyl group-contg. nitrile rubber and (d) aromatic polyamine-based hardener, preferably, in a b/a ratio of about 0.01W 3.5 and (a+b)/c ratio of about 0.2W5.0. When b/a is smaller than about 0.01 adhesive strength is lowere while when it exceeds about 3.5, the circuit board loses flexibility.
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Inventors:
FURUHATA TOSHIKAZU
Application Number:
JP18785583A
Publication Date:
May 04, 1985
Filing Date:
October 07, 1983
Export Citation:
Assignee:
MITSUI PETROCHEMICAL IND
International Classes:
H05K3/38; C08G59/00; C08G59/20; C08G59/28; C08G59/40; C08G59/50; C08L7/00; C08L21/00; C08L63/00; C09J163/00; (IPC1-7): C08G59/20; C08G59/40; C08G59/50; C09J3/16; H05K3/38
Domestic Patent References:
| JPS58142955A | 1983-08-25 |
Attorney, Agent or Firm:
Toshio Yoshida
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