Title:
接着剤組成物、接着剤シートならびにこれらを用いた硬化物および半導体装置
Document Type and Number:
Japanese Patent JP6299607
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).
Inventors:
Akira Shimada
Koichi Aoki
Koichi Aoki
Application Number:
JP2014558541A
Publication Date:
March 28, 2018
Filing Date:
January 16, 2014
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J179/08; C08G59/44; C08K3/00; C08L63/00; C08L79/08; C09J7/20; C09J11/04; C09J163/00
Foreign References:
| WO2012073851A1 |