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Title:
接着剤組成物、回路接続構造体及び半導体装置
Document Type and Number:
Japanese Patent JP5338051
Kind Code:
B2
Inventors:
Naoto Kudo
Hiroyuki Izawa
Toshiaki Shirasaka
Tomoyasu Honda
Katogi Shigeki
Application Number:
JP2007224376A
Publication Date:
November 13, 2013
Filing Date:
August 30, 2007
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J175/06; C09J4/00; C09J9/02; H01B1/22; H01L21/60; H05K1/03; H05K3/32
Domestic Patent References:
JP11080285A
JP2004890A
JP56159266A
JP2006318990A
JP2006077049A
JP6263982A
JP2005123025A
JP2006104297A
Foreign References:
WO2001015505A1
WO2005090509A1
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Ryugo Akahori