To provide an adhesive for circuit connection which comprises a composition having low-temperature quickly curing property and practical preservation stability, does not cause corrosion of a metallic substrate being an adherend or a circuit electrode composed of a metal and inorganic material and can prevent reliability degradation, and to provide a circuit connection method and a connection body using the adhesive.
The adhesive for circuit connection includes an adhesive composition comprising an epoxy compound (A), a photocation generator (B), a metal hydroxide or metal oxide (C) and a reaction adjuster (D), and electric conductive particles. The metal hydroxide or metal oxide (C) is at least one selected from hydroxides of aluminum, magnesium and calcium, and oxides of silicon, aluminum, magnesium, antimony, tin, titanium, manganese and zirconium. The reaction adjuster (D) is a chain ether compound or cyclic ether compound.
KATOGI SHIGEKI
| JP2004231957A | 2004-08-19 | |||
| JP2002155258A | 2002-05-28 | |||
| JP2002235065A | 2002-08-23 | |||
| JP2000169821A | 2000-06-20 | |||
| JPS58198532A | 1983-11-18 | |||
| JPH03252488A | 1991-11-11 | |||
| JP2000144071A | 2000-05-26 | |||
| JPH08511570A | 1996-12-03 |
| WO2003106582A1 | 2003-12-24 |
Yoshinori Shimizu
Hiroyuki Hirano