Title:
ダイシング用粘着シート用粘着剤、ダイシング用粘着シート、半導体素子の製造方法、半導体素子
Document Type and Number:
Japanese Patent JP4518535
Kind Code:
B2
Abstract:
To provide an adhesive for adhesive sheet for dicing, slight in producing transfer contaminants and capable of easily picking up a semiconductor element without causing any deformation, to provide such an adhesive sheet provided with an adhesive layer formed by the adhesive, to provide a method for producing such a semiconductor element using the adhesive sheet, and to provide the resultant semiconductor element.
The adhesive for adhesive sheet for dicing comprises a base polymer, a radiation-curable compound having in one molecule five or more carbon-carbon double bonds, and a low-molecular component 100-1,000 in molecular weight containing in one molecule 1-4 carbon-carbon double bonds.
COPYRIGHT: (C)2005,JPO&NCIPI
Inventors:
Tomoichi Takahashi
Masashi Yamamoto
Masashi Yamamoto
Application Number:
JP2003189564A
Publication Date:
August 04, 2010
Filing Date:
July 01, 2003
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/02; C09J133/04; C09J4/00; C09J4/02; C09J133/00; C09J201/00; H01L21/301
Domestic Patent References:
| JP5214298A | ||||
| JP2187478A | ||||
| JP11349854A | ||||
| JP2001064593A | ||||
| JP11288907A | ||||
| JP2002373871A | ||||
| JP2002256236A | ||||
| JP2002371262A |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi