Title:
ADHESIVE FOR ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2012111798
Kind Code:
A
Abstract:
To provide an adhesive for electronic parts that has a superior suppression effect on void.
The adhesive for electronic parts contains: an episulfide compound having a naphthalene skeleton and/or an episulfide compound having a resorcinol skeleton; an epoxy compound; and a curing agent.
Inventors:
MASUI RYOHEI
HATAI MUNEHIRO
HAYAKAWA AKINOBU
HATAI MUNEHIRO
HAYAKAWA AKINOBU
Application Number:
JP2010259335A
Publication Date:
June 14, 2012
Filing Date:
November 19, 2010
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C09J181/02; C09J11/00; C09J163/00
Foreign References:
| WO2010035459A1 | 2010-04-01 |
Attorney, Agent or Firm:
Atomi International Patent Office
Previous Patent: GRANULAR DETERGENT AND METHOD OF MANUFACTURING GRANULAR DETERGENT
Next Patent: RUBBER COMPOSITION, VULCANIZED RUBBER AND TIRE
Next Patent: RUBBER COMPOSITION, VULCANIZED RUBBER AND TIRE