Title:
Adhesive encapsulation resin composition, adhesive encapsulation film, organic electroluminescence element, and image display device
Document Type and Number:
Japanese Patent JP6310276
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: an adhesively sealing resin composition which enables the achievement of the balance of low permeability and adhesive force, and the prevention of water infiltration into an organic EL element by arranging a single adhesive layer including vinylidene chloride copolymer and tackifier resin in order to eliminate the displacement at an interface between a polymer film and an adhesive layer or between a substrate and an adhesive layer; an adhesively sealing film; an organic electroluminescent element; and an image display device.SOLUTION: An adhesively sealing resin composition according to the present invention is one for sealing an element for an organic electronic device. The adhesively sealing resin composition comprises: vinylidene chloride copolymer; and tackifier resin.
Inventors:
Keiji Saito
Masami Aoyama
Takumi Asanuma
Tetsuya Saegusa
Masami Aoyama
Takumi Asanuma
Tetsuya Saegusa
Application Number:
JP2014034399A
Publication Date:
April 11, 2018
Filing Date:
February 25, 2014
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H05B33/04; C09J7/00; C09J11/08; C09J127/08; G09F9/30; H01L27/32; H01L51/50
Domestic Patent References:
| JP2012238463A | ||||
| JP2155195A | ||||
| JP2009187804A | ||||
| JP2013138022A | ||||
| JP2012107115A |
Foreign References:
| WO2013103284A1 |
Attorney, Agent or Firm:
Ryo Matsushita
Hashimoto Takako
Hashimoto Takako