To prepare an adhesive film giving a flexible metal-clad laminate having excellent moisture-absorbing soldering heat resistance, and to provide a flexible metal-clad laminate obtained by adhering a metal foil to the adhesive film.

The adhesive film produced by disposing an adhesive layer comprising a thermoplastic polyimide and a cyanate resin on at least one side of a polyimide film is characterized in that the polyimide film has phenolic hydroxyl groups capable of reacting with the cyanate, and the glass transition temperature of the adhesive layer is 235 to 300°C.