Title:
ADHESIVE FILM AND ITS EVALUATION METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND INTEGRATED DICING AND DIE BONDING FILM
Document Type and Number:
Japanese Patent JP2022135565
Kind Code:
A
Abstract:
To provide an evaluation method for adhesive films that can be used to evaluate adhesive films with a thickness of 20 μm or less and that is useful for addressing the problem of peeling caused by warping of semiconductor chips in the semiconductor device manufacturing process.SOLUTION: An evaluation method of the present disclosure includes the process of performing a tack test with a heated probe, and the thickness of the adhesive film to be evaluated is 20 μm or less. The tack test is performed, for example, using an apparatus equipped with a stage supporting a sample of adhesive film and a probe that is movable in a vertical direction with respect to the stage and whose temperature can be set, with a polyimide film interposed between the stage and the sample.SELECTED DRAWING: Figure 1
Inventors:
TAZAWA TSUYOSHI
YAMAMOTO KAZUHIRO
NAKAMURA KANAMI
TANIGUCHI KOHEI
TAIRA MASAKO
YAMAMOTO KAZUHIRO
NAKAMURA KANAMI
TANIGUCHI KOHEI
TAIRA MASAKO
Application Number:
JP2021035469A
Publication Date:
September 15, 2022
Filing Date:
March 05, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
H01L21/52; C09J7/00; C09J7/38; C09J201/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yohei Suzuki
Yoshinori Shimizu
Hiroyuki Hirano
Yohei Suzuki