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Title:
ADHESIVE FILM, ITS MANUFACTURING METHOD AND LAMINATE OF METAL FOIL PROVIDED WITH THE ADHESIVE FILM
Document Type and Number:
Japanese Patent JP2002317159
Kind Code:
A
Abstract:

To provide an adhesive film excellent in adhesive strength, heat resistance (especially solder heat resistance), dimension stability and strength.

An adhesive film having an adhesive layer comprising a heat- resistant film and a resin of a thermoplastic polyimide as a main component, wherein the heat-resistant film has water absorption of less than 1.0% and adhesive strength between the heat-resistant film and the adhesive layer is not less than 0.8 kg/cm is provided. A manufacturing method of the heat- resistant film includes processes of far-infrared ray treatment of the heat- resistant film at an atmospheric temperature of 450°C-550°C and/or plasma treatment of the surface of the heat-resistant film.


Inventors:
TANAKA SHIGERU
KATAOKA KOSUKE
FURUYA HIROYUKI
Application Number:
JP2001123678A
Publication Date:
October 31, 2002
Filing Date:
April 20, 2001
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
B32B7/12; B32B27/34; C09J7/02; C09J179/08; H05K1/03; (IPC1-7): C09J7/02; B32B7/12; B32B27/34; C09J179/08; H05K1/03
Domestic Patent References:
JPS62280224A1987-12-05
JPH11245244A1999-09-14
JPH083338A1996-01-09
JPH10130594A1998-05-19
JP2000319392A2000-11-21
Attorney, Agent or Firm:
Shusaku Yamamoto



 
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