Title:
接着フィルム、その製造法、半導体素子と支持部材との接着法、接着フィルム付き支持部材及び半導体装置
Document Type and Number:
Japanese Patent JP5002089
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an adhesive film having excellent low-temperature applicability and low hygroscopicity, etc., and further a high adhesive strength while hot and pressure cooker test(PCT) resistance, to provide a supporting member provided with the adhesive film and to provided a semiconductor device capable of ensuring high reliability under high-temperature and high-humidity conditions. SOLUTION: This adhesive film comprises (D) a polyimide resin obtained by reacting a tetracarboxylic dianhydride comprising (A) a tetracarboxylic dianhydride having a 2-20C alkylene chain and (B) an aromatic tetracarboxylic dianhydride having 1-4 aromatic rings with (C) a siloxanediamine. The method for bonding a semiconductor element to the supporting member is characterized by sandwiching the adhesive film between the semiconductor element and the supporting member and carrying out thermocompression bonding. The supporting member provided with the adhesive film is obtained by bonding the adhesive film to the supporting member. The semiconductor device comprises a structure in which the semiconductor element is bonded to the supporting member using the adhesive film.
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Inventors:
Yasuhisa Odagawa
Application Number:
JP2000358671A
Publication Date:
August 15, 2012
Filing Date:
November 27, 2000
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J7/00; C09J179/08; C09J183/10; C09J201/00; H01L21/52
Domestic Patent References:
| JP1192744A | ||||
| JP8507821A | ||||
| JP11228913A | ||||
| JP2180961A | ||||
| JP6264035A | ||||
| JP10163188A | ||||
| JP2001163188A |
Attorney, Agent or Firm:
Hidekazu Miyoshi