Title:
プリント配線基板用貼付フィルム
Document Type and Number:
Japanese Patent JP7181933
Kind Code:
B2
Abstract:
An adhesive film for a printed wiring board includes an adhesive layer 111 and an insulating protective layer 112. The insulating protective layer has an areal material ratio (Smr2) of 91% or less, the areal material ratio (Smr2) dividing reduced valleys from a core.
Inventors:
Masahiro Watanabe
Application Number:
JP2020529068A
Publication Date:
December 01, 2022
Filing Date:
July 05, 2019
Export Citation:
Assignee:
Tatsuta Electric Wire Co., Ltd.
International Classes:
H05K3/28; C09J7/30; H05K9/00
Domestic Patent References:
| JP2013061636A | ||||
| JP2015106500A | ||||
| JP2014112576A |
Foreign References:
| WO2008020578A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office