Title:
ADHESIVE FILM FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER AND METHOD FOR PROTECTING THE SEMICONDUCTOR WAFER USING THE SAME
Document Type and Number:
Japanese Patent JP3740451
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive film for protecting a surface of a semiconductor wafer having excellent adhesion, damage preventing property and non- staining.
SOLUTION: In an adhesive film for protecting a surface of a semiconductor wafer, at least one intermediate layer and an adhesive layer are provided on one surface of a base material film. A minimum (G'min) of storage elastic modulus (G') at 50 to 100°C in the adhesive layer (B) is 0.07 to 5 MPa, storage elastic modulus at 50°C in at least one layer (C) of the intermediate layer is 0.001 MPa or more and less than 0.07 MPa, and the total thickness (tc, unit: μm) of the thickness (tb, unit: μm) of the adhesive layer (B) and the intermediate layer (C) having the storage elastic modulus satisfies a relation of the below- mentioned numerical expression (1). tc≥3tb...(1).
Inventors:
Miyagawa Seiji
Yasuhisa Fujii
Makoto Kataoka
Yoshihisa Saimoto
Shinichi Hayakawa
Yasuhisa Fujii
Makoto Kataoka
Yoshihisa Saimoto
Shinichi Hayakawa
Application Number:
JP2002278390A
Publication Date:
February 01, 2006
Filing Date:
September 25, 2002
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
H01L21/304; C09J7/29; C09J201/00; H01L21/00; H01L21/68; (IPC1-7): H01L21/304; C09J7/02; C09J201/00
Domestic Patent References:
| JP2001203255A |
Attorney, Agent or Firm:
Shinichi Naemura