Title:
接着フィルム、半導体装置の製造方法および半導体装置
Document Type and Number:
Japanese Patent JP6556936
Kind Code:
B2
Abstract:
The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.
Inventors:
Jun Hak Kim
Hee jun kim
Se La Kim
Kwan Ju Yi
Yong Kuk Kim
Sun Hee Nam
Hee jun kim
Se La Kim
Kwan Ju Yi
Yong Kuk Kim
Sun Hee Nam
Application Number:
JP2018503163A
Publication Date:
August 07, 2019
Filing Date:
September 23, 2016
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
H01L21/52; C09J7/10; C09J133/14; C09J163/00; C09J201/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2011165716A | ||||
| JP2007051272A | ||||
| JP2012099799A |
Attorney, Agent or Firm:
Shinya Mitsuhiro
Takashi Watanabe
Takashi Watanabe