Title:
ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME USING THE SAME, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2006295064
Kind Code:
A
Abstract:
To provide an adhesive film for a semiconductor which has high adhesive properties to a lead frame which is subjected to a surface process such as an organic film coating, etc. , and can simply be peeled off from the lead frame and a sealing resin after being sealed with a resin.
In the adhesive film for the semiconductor, a resin layer contains a polymer having a repetitive unit represented by a general formula (I) (wherein Y denotes a radical represented by a general formula (II) and Y may be different every repetitive units), and has a contact angle of 50-80° with respect to water. The resin layer is formed on one face or both faces of a support film.
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Inventors:
KAWAI AKIYASU
TOMOTA NAOKO
MATSUURA SHUICHI
TOMOTA NAOKO
MATSUURA SHUICHI
Application Number:
JP2005117212A
Publication Date:
October 26, 2006
Filing Date:
April 14, 2005
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L21/56; C09J7/02; C09J177/10; C09J179/08; H01L23/50
Foreign References:
| WO2004075293A1 | 2004-09-02 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu